CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcem

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CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcem

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CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcem

mobile phone COF driver Panasonic material PIGL042504-250MH, CU9/1um, Baoli oil + PI reinforcement Product Description Number of floors: 1 floor Plate thickness: 0.15mm, Panasonic material PIGL042504...

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molded interconnect substrate

ic substrate pcb

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