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Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level

    Buy cheap Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level from wholesalers
     
    Buy cheap Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level from wholesalers
    • Buy cheap Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level from wholesalers
    • Buy cheap Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level from wholesalers
    • Buy cheap Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level from wholesalers

    Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : CSPCB1530
    Certification : ISO/UL/RoHS/TS
    Price : usd2.28/pcs
    Payment Terms : L/C, T/T, Western Union, MoneyGram
    Supply Ability : 2000K/pcs per month
    Delivery Time : 15-20day
    • Product Details
    • Company Profile

    Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level

    8 layers HD3 level, embedded copper PCB embedded embedded capacitance / buried resistance PCB Communication Network Optical Module PCB Power Optical Module PCB Wireless Optical Module PCB High Power Optical Module PCB

    Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.


    Product Description

    1. PCBA Technology Capability
    2. Smallest chip placement:0201
    3. Automated axial insertion and Automated radial insertion
    4. Computer controlled Pb free wave soldering system
    5. High speed Pb free surface mount production lines
    6. Providing electronic components purchase service for the customers
    7. ICT on line inspection, PCBA function test equipment, Visual inspection

    Product Details


    1. Number of layers: 8L soft and hard combined HDI first-order layered board,
    2. Plate thickness: 1.60mm
    3. Process structure: 3m buried material + FR-4TG170, impedance Ω ± 10%,impedance Ω±10%, resin plug hole + copper fill hole
    4. Buried copper block + nose PAD + minimum hole 0.20mm
    5. Surface treatment: Shen Jin + electricity gold 3u"
    6. Minimum hole copper: 25um
    7. Quantities range from prototype to volume production.
    8. 100% E-Test
    9. Packing: vacuum packaging / tin wrapped paper + humidity card + moisture-proof + carton packaging

    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    PCB, FPC main material supplier

    NOsupplierSupply material nameMaterial origin
    1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
    2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
    3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
    4SanTiePI, covering membraneJapan
    5Born goodFR-4,PI,PP,Copper berthshenzhen, China
    6A rainbowPI, covering membrane,Copper berthTaiwan
    7teflonHigh frequency materialsThe United States
    8RogersHigh frequency materialsThe United States
    9Nippon SteelPI, covering membrane,Copper berthTaiwan
    10sanyoPI, covering membrane,Copper berthJapan
    11South AsiaFR-4,PI,PP,Copper berthTaiwan
    12doosanFR-4,PPSouth Korea
    13Tai Yao plateFR-4,PP,Copper berthTaiwan
    14AlightFR-4,PP,Copper berthTaiwan
    15YaoguangFR-4,PP,Copper berthTaiwan
    16YalongFR-4,PPThe United States
    17ISOALFR-4,PPJapan
    18OAKBuried, buried resistance, PPJapan
    19United States 3MFR-4,PPThe United States
    20BergsCopper and aluminum matrixJapan
    21The suninkTaiwan
    22MuratainkJapan
    23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
    24YasenPPI, covering membraneChina jiangsu
    25Yong Sheng TaiinkChina guangdong panyu
    26mitainkJapan
    27Transcriptceramic materialTaiwan
    28HOMEceramic materialJapan
    29Fe-Ni-MnAlloy Invar, Section SteelTaiwan
    PCBs material: FR-4, 0.5oz - 6oz copper
    0.45 to 3.2mm thickness
    Minimum line width and line spacing: 4mil/4mil
    Minimum hole diameter: 0.2mm
    Maximum panel size: 680 x 1280mm
    Surface finishing:
    • HAL, alpha level, gold plating, ENTech
    • HAL or tin and gold plating
    Solder mask type: liquid photoimageable solder mark
    Precision V-cut or routing for panel form design
    OEM orders for SMT and A/I assembly projects accepted
    Gerber file preferred
    Please note the following information are for your reference on our manufacturing capability, not for inquiries on quotations
    We will offer our best prices if you can send your own PCB design


    Product Details:
    Place of Origin:China
    Brand Name:XCE
    Certification:CE,ROHS, FCC,ISO9008,SGS,UL
    Model Number:XCEH
    Minimum Order Quantity:1pcs
    Price:negotiation
    Packaging Details:inner: vacuum-packed bubble bag outer: carton box
    Delivery Time:5-10 days
    Payment Terms:T/T,Western union
    Supply Ability:1, 000, 000 PCS / week

    Advantage Highlights

    • Specialized in 2- to 32-layer PCB
    • ISO 9001-, ISO 14001- and ISO/TS 16949-certified
    • Products are UL- and RoHS-certified
    • Partner for over 2000 small- and medium-scale customers
    • Two factory bases totaling 22,000 square meters
    • Less than 12-hours quick response to inquiries
    • Widely acclaimed and satisfying services
    • Over 66% of PCBs are exported to international markets

    OEM Flexible Rigid PCB HDI 3m Buried Material FR4 TG170 For Optical Module ProductOEM Flexible Rigid PCB HDI 3m Buried Material FR4 TG170 For Optical Module Product

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