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18 Layers FR4 Printed Circuit Board HDI TG170 M6 Inner / Outer Copper ENIG Surface

    Buy cheap 18 Layers FR4 Printed Circuit Board HDI TG170 M6 Inner / Outer Copper ENIG Surface from wholesalers
     
    Buy cheap 18 Layers FR4 Printed Circuit Board HDI TG170 M6 Inner / Outer Copper ENIG Surface from wholesalers
    • Buy cheap 18 Layers FR4 Printed Circuit Board HDI TG170 M6 Inner / Outer Copper ENIG Surface from wholesalers
    • Buy cheap 18 Layers FR4 Printed Circuit Board HDI TG170 M6 Inner / Outer Copper ENIG Surface from wholesalers

    18 Layers FR4 Printed Circuit Board HDI TG170 M6 Inner / Outer Copper ENIG Surface

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : CSPCB1521
    Certification : ISO/UL/RoHS/TS
    Price : usd4.28/PCS
    Payment Terms : T/T, Western Union
    Supply Ability : 50-200K/pcs per month
    Delivery Time : 20-30day
    • Product Details
    • Company Profile

    18 Layers FR4 Printed Circuit Board HDI TG170 M6 Inner / Outer Copper ENIG Surface

    Lightweight 94v0 PCB Board Green Mask Rogers 5880 0.254mm 0.2mm Hole Size

    Ceramic based pcbs with 3.0mm thickness white soldermask and plated gold

    Single side white ink high conductivity thick bergquist ceramic based board with 3mm

    Matel material: Ceramic

    Laryers: 1L

    Size: 34mm*36mm

    Thickness: 3.0mm

    Copper thickness: 1 oz

    Surface treatment: plated gold

    Solar mask: White

    Silk screen: No

    Thermal conductivity: 2 W/m.k

    Line width/space: 0.76/1.02mm

    Special hole: No

    Min.hole: 1mm(NPTH)

    File format: Gerber

    Shaping: CNC

    Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

    audio frequency facility such as Input and output amplifier, balanced amplifier, audio amplifier, preamplifier, power amplifier, audio shielding system,

    power facility such as Switching regulator, DC/DC converters, SW regulator, electric welding machine, vacuum cleaner, miner's lamp, power supply module, electronic energy-saving lamps, etc

    Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate.

    We are one of the professional ceramic based pcbs with 3.0mm thickness white soldermask and plated gold manufacturers and suppliers in China, offering the best services and the highest quality solutions for you. Please rest assured to get the high quality products made in China from our factory.

      Product Description​

      Product area: automotive products Number of layers: 10L third-order HDI plate thickness 1.60mm ± 10%; Process structure: Shengyi FR-4+TG150, minimum hole 0.10mm, copper thickness 1OZ, line width line spacing 3/3mil,impedance Ω±10%, Resin plug hole + copper fill hole Surface treatment: electric gold 1u" Quantities range from prototype to volume production. 100% E-Test Packing: vacuum packaging + humidity card + moisture-proof beads + carton


      FAQ:

      Q: What files do you use in PCB fabrication?

      A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

      Q: Is it possible you could offer sample?

      A: Yes, we can custom you sample to test before mass production

      Q: When will I get the quotation after sent Gerber, BOM and test procedure?

      A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

      Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

      A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

      Q: How can I make sure the quality of my PCB?

      A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

      Electric Rigid FR4 Copper Clad Circuit Board , Circuit Board Printing ServiceElectric Rigid FR4 Copper Clad Circuit Board , Circuit Board Printing Service

      PCB, FPC product application field

      Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products


        Our Service


        PCB, FPC process production capability

        Technical ltemMassProductAdvanced Technology
        201620172018
        Max.Layer Count26L36L80L
        Through-hole plate2~45L2~60L2~80L
        Max.PCBSize(in)24*52"25*62"25*78.75"
        The layer number of FPC1~36L1~50L1~60L
        Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
        Layeredplatelayer2~12L2~18L2~26L
        Max.PCBSize(in)9"*48"9"*52"9"*62"
        Combination of hard and soft layers3~26L3~30L3~50L
        Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
        HDI PCB4~45L4~60L4~80L
        Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
        Max.PCBSize(in)24"*43"24"*49"25"*52"
        MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
        Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
        Build-up MaterialFR-4FR-4FR-4
        BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
        Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
        Min.18L(mm)0.632.0~8.00.51~10.0mm
        Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
        MAX(mm)3.510.0mm10.0mm
        Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
        Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
        BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
        Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
        Gold thick1~40u"1~60u"1~120u"
        Nithick76~127u"76~200u"1~250u"
        Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
        Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
        Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
        DieletricThickness38(1.5)32(1.3)32(1.3)
        125(5)125(5)125(5)
        SKipviaYesYesYes
        viaoNhie(laserviaon BuriedPTH)YesYesYes
        Laser Hole FillingYesYesYes
        TechnicalltemMass ProductAdvanced Technolgy
        2017year2018year2019year
        Drill hole depth ratioThroughHole2017year.40:1.40:1
        Aspet RatioMicro Via.35:11.2:11.2:1
        Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
        Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
        Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
        BGAPitch mm(Mil)0.30.30.3
        Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
        Line Width Control∠2.5MIL±0.50±0.50±0.50
        2.5Mil≤L/W∠4mil±0.50±0.50±0.50
        ≦3mil±0.60±0.60±0.60
        Laminated structureLayer by layer3+N+34+N+45+N+5
        Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
        Multi-layer overlayN+NN+NN+N
        N+X+NN+X+NN+X+N
        sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
        Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
        PTH filling processPTH resin plug hole + plating fill
        Electroplated hole/copper plug hole
        PTH resin plug hole + plating fill
        Electroplated hole/copper plug hole
        PTH resin plug hole + plating fill
        Electroplated hole/copper plug hole

        PCB, FPC main material supplier

        NOsupplierSupply material nameMaterial origin
        1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
        2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
        3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
        4SanTiePI, covering membraneJapan
        5Born goodFR-4,PI,PP,Copper berthshenzhen, China
        6A rainbowPI, covering membrane,Copper berthTaiwan
        7teflonHigh frequency materialsThe United States
        8RogersHigh frequency materialsThe United States
        9Nippon SteelPI, covering membrane,Copper berthTaiwan
        10sanyoPI, covering membrane,Copper berthJapan
        11South AsiaFR-4,PI,PP,Copper berthTaiwan
        12doosanFR-4,PPSouth Korea
        13Tai Yao plateFR-4,PP,Copper berthTaiwan
        14AlightFR-4,PP,Copper berthTaiwan
        15YaoguangFR-4,PP,Copper berthTaiwan
        16YalongFR-4,PPThe United States
        17ISOALFR-4,PPJapan
        18OAKBuried, buried resistance, PPJapan
        19United States 3MFR-4,PPThe United States
        20BergsCopper and aluminum matrixJapan
        21The suninkTaiwan
        22MuratainkJapan
        23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
        24YasenPPI, covering membraneChina jiangsu
        25Yong Sheng TaiinkChina guangdong panyu
        26mitainkJapan
        27Transcriptceramic materialTaiwan
        28HOMEceramic materialJapan
        29Fe-Ni-MnAlloy Invar, Section SteelTaiwan

        Quality Assurance:
        Our Quality processes include:
        1. IQC: Incoming Quality Control (Incoming Materials Inspection)
        2. First Article Inspection for every process
        3. IPQC: In Process Quality Control
        4. QC: 100% Test & Inspection
        5. QA: Quality Assurance based on QC inspection again
        6. Workmanship: IPC-A-610, ESD
        7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

        Certificates:
        ISO9001-2008
        ISO/TS16949
        UL
        IPC-A-600G and IPC-A-610E Class II compliance
        Customer's requirements

        Quick Detail:


        • PCB Production Service.
        • PCB FPC design Service.
        • PCB Assembly Service. (SMT, BGA, DIP)
        • PCBA Housing assembly serivce.
        • PCBA Final Functional Testing.
        • PCB PCBA Copy Service.
        • Electronic Components Purchasing & BOM List Purchasing Services.
        • PCB SMT Stencil. (Laser cut & Etching)
        • Quality Assurance:
          Our Quality processes include:
          1. IQC: Incoming Quality Control (Incoming Materials Inspection)
          2. First Article Inspection for every process
          3. IPQC: In Process Quality Control
          4. QC: 100% Test & Inspection
          5. QA: Quality Assurance based on QC inspection again
          6. Workmanship: IPC-A-610, ESD
          7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

          Certificates:
          ISO9001-2008
          ISO/TS16949
          UL
          IPC-A-600G and IPC-A-610E Class II compliance
          Customer's requirements


          Quick Detail:

          1. PCB Assembly on SMT and DIP

          2. PCB schematic drawing/ layout /producing

          3. PCBA clone/change board

          4. Components sourcing and purchasing for PCBA

          5. Enclosure design and plastic injection molding

          6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

          7. IC programming


          PCB, FPC product application field
          Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products


          FAQ:
          Q: What files do you use in PCB fabrication?
          A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
          Q: Is it possible you could offer sample?
          A: Yes, we can custom you sample to test before mass production
          Q: When will I get the quotation after sent Gerber, BOM and test procedure?
          A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
          Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
          A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
          Q: How can I make sure the quality of my PCB?
          A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

        • PCB Assembly on SMT and DIP
        • PCB schematic drawing/ layout /producing
        • PCBA clone/change board
        • Components sourcing and purchasing for PCBA
        • Enclosure design and plastic injection molding
        • Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,
        • IC programming
        Quality 18 Layers FR4 Printed Circuit Board HDI TG170 M6 Inner / Outer Copper ENIG Surface for sale
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