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Double Layer Multilayer Printed Circuit Board High Thermal Conductivity Aluminum Base 1W-8W

    Buy cheap Double Layer Multilayer Printed Circuit Board High Thermal Conductivity Aluminum Base 1W-8W from wholesalers
     
    Buy cheap Double Layer Multilayer Printed Circuit Board High Thermal Conductivity Aluminum Base 1W-8W from wholesalers
    • Buy cheap Double Layer Multilayer Printed Circuit Board High Thermal Conductivity Aluminum Base 1W-8W from wholesalers
    • Buy cheap Double Layer Multilayer Printed Circuit Board High Thermal Conductivity Aluminum Base 1W-8W from wholesalers
    • Buy cheap Double Layer Multilayer Printed Circuit Board High Thermal Conductivity Aluminum Base 1W-8W from wholesalers

    Double Layer Multilayer Printed Circuit Board High Thermal Conductivity Aluminum Base 1W-8W

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : CSPCB1475
    Certification : ISO/UL/RoHS/TS
    Price : usd1.90/pcs
    Payment Terms : T/T, Western Union
    Supply Ability : 2000000pcs/per month
    Delivery Time : 10-15day
    • Product Details
    • Company Profile

    Double Layer Multilayer Printed Circuit Board High Thermal Conductivity Aluminum Base 1W-8W

    6-laye High thermal conductivity aluminum base 1W-8W double-layer aluminum-based LED PCB,aluminum base + FR-4 + PPTG180,Multilayer Printed Circuit Board ,quick turn pcb


    Product Description

    1. Product area: LED driver products
    2. Number of layers: 6-laye High thermal conductivity aluminum base 1W-8W
    3. Plate thickness: 1.60mm
    4. Product structure: aluminum base + FR-4 + PPTG180, High thermal conductivity aluminumbase 1W-8W
    5. copper thickness 3OZ, sinking holes, electric nickel gold 5U "
    6. Quantities range from prototype to volume production.
    7. 100% E-Test
    8. Packaging: Vacuum Packaging + Moisture-proof Bead + Humidity Card + Carton
    9. Printed circuit board (pcb) and PCBA product areas
      Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
      Winding circuit board (fpc) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

    Primary competitive advantages

    1. Profound knowledge of contract manufacturing services
    2. Capable of developing effective production process to ensure high-quality and consistency
    3. Experienced logistics management
    4. Cost-effective factory located in mainland China
    5. Able to handle small as well as large volume production with flexibility
    6. We also had launched six Sigma DMAIC program since January 2002
    7. Our building products experience range: industrial, automotive, computing, storage, consumer, instrumentation, medicals, networking, peripherals and tele communications

    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    PCB, FPC main material supplier

    NOsupplierSupply material nameMaterial origin
    1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
    2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
    3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
    4SanTiePI, covering membraneJapan
    5Born goodFR-4,PI,PP,Copper berthshenzhen, China
    6A rainbowPI, covering membrane,Copper berthTaiwan
    7teflonHigh frequency materialsThe United States
    8RogersHigh frequency materialsThe United States
    9Nippon SteelPI, covering membrane,Copper berthTaiwan
    10sanyoPI, covering membrane,Copper berthJapan
    11South AsiaFR-4,PI,PP,Copper berthTaiwan
    12doosanFR-4,PPSouth Korea
    13Tai Yao plateFR-4,PP,Copper berthTaiwan
    14AlightFR-4,PP,Copper berthTaiwan
    15YaoguangFR-4,PP,Copper berthTaiwan
    16YalongFR-4,PPThe United States
    17ISOALFR-4,PPJapan
    18OAKBuried, buried resistance, PPJapan
    19United States 3MFR-4,PPThe United States
    20BergsCopper and aluminum matrixJapan
    21The suninkTaiwan
    22MuratainkJapan
    23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
    24YasenPPI, covering membraneChina jiangsu
    25Yong Sheng TaiinkChina guangdong panyu
    26mitainkJapan
    27Transcriptceramic materialTaiwan
    28HOMEceramic materialJapan
    29Fe-Ni-MnAlloy Invar, Section SteelTaiwan

    Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray


    PCB, FPC product application field
    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products


    FAQ:
    Q: What files do you use in PCB fabrication?
    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
    Q: Is it possible you could offer sample?
    A: Yes, we can custom you sample to test before mass production
    Q: When will I get the quotation after sent Gerber, BOM and test procedure?
    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
    Q: How can I make sure the quality of my PCB?
    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.


    2-laye Copper base double-layer aluminum-based LED PCB,aluminum base + FR-4 + PPTG180,Multilayer Printed Circuit Board ,

    Quality Double Layer Multilayer Printed Circuit Board High Thermal Conductivity Aluminum Base 1W-8W for sale
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