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Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure FR 4

    Buy cheap Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure FR 4 from wholesalers
     
    Buy cheap Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure FR 4 from wholesalers
    • Buy cheap Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure FR 4 from wholesalers
    • Buy cheap Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure FR 4 from wholesalers

    Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure FR 4

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : cspcb1290
    Certification : ISO/UL/RoHS/TS
    Price : usd29.10/pcs
    Payment Terms : T/T, Western Union
    Supply Ability : 10-200K/pcs per month
    Delivery Time : 15-18day
    • Product Details
    • Company Profile

    Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure FR 4

    Rigid Flex Board Pcb Fabrication Assembly 5G High Frequency Mixed Pressure HDI Printed circuit board pcb

    18-layer third-order, 5G high-frequency mixed-pressure HDI
    1:5G communication network products
    2: FR-4, TG170+ Panasonic M6, third-order soft and hard combination, minimum line width 3/3mil, minimum hole 0.10mm, blind hole, immersion gold, black oil, white
    3: plate thickness 1.8mm, minimum line width line spacing 3/3mil, impedance ±10%, resin plug hole + plating hole filling, green oil, white characters

    Product structure: 18-layer high-frequency mixed pressure HDI
    Material: FR-4, TG170, halogen-free + Panasonic M7
    Board thickness: 0.50MM
    Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
    Standard.
    4: Quantities range from prototype to volume production.
    100% E-Test

    Printed circuit board (pcb) and PCBA product areas
    Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
    Winding circuit board (fpc) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

    5: PCB, FPC process production capability

    Our Quality processes include

    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
    8. Quality Assurance:
      Our Quality processes include:
      1. IQC: Incoming Quality Control (Incoming Materials Inspection)
      2. First Article Inspection for every process
      3. IPQC: In Process Quality Control
      4. QC: 100% Test & Inspection
      5. QA: Quality Assurance based on QC inspection again
      6. Workmanship: IPC-A-610, ESD
      7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004


      Certificates:
      ISO9001-2008
      ISO/TS16949
      UL
      IPC-A-600G and IPC-A-610E Class II compliance
      Customer's requirements


      Quick Detail:

      1. PCB Assembly on SMT and DIP

      2. PCB schematic drawing/ layout /producing

      3. PCBA clone/change board

      4. Components sourcing and purchasing for PCBA

      5. Enclosure design and plastic injection molding

      6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

      7. IC programming

      Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

      PCB, FPC product application field

      Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

      FAQ:

      Q: What files do you use in PCB fabrication?

      A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

      Q: Is it possible you could offer sample?

      A: Yes, we can custom you sample to test before mass production

      Q: When will I get the quotation after sent Gerber, BOM and test procedure?

      A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

      Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

      A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

      Q: How can I make sure the quality of my PCB?

      PCB, FPC process production capability

      Technical ltemMassProductAdvanced Technology
      201620172018
      Max.Layer Count26L36L80L
      Through-hole plate2~45L2~60L2~80L
      Max.PCBSize(in)24*52"25*62"25*78.75"
      The layer number of FPC1~36L1~50L1~60L
      Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
      Layeredplatelayer2~12L2~18L2~26L
      Max.PCBSize(in)9"*48"9"*52"9"*62"
      Combination of hard and soft layers3~26L3~30L3~50L
      Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
      HDI PCB4~45L4~60L4~80L
      Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
      Max.PCBSize(in)24"*43"24"*49"25"*52"
      MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
      Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
      Build-up MaterialFR-4FR-4FR-4
      BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
      Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
      Min.18L(mm)0.632.0~8.00.51~10.0mm
      Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
      MAX(mm)3.510.0mm10.0mm
      Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
      Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
      BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
      Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
      Gold thick1~40u"1~60u"1~120u"
      Nithick76~127u"76~200u"1~250u"
      Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
      Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
      Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
      DieletricThickness38(1.5)32(1.3)32(1.3)
      125(5)125(5)125(5)
      SKipviaYesYesYes
      viaoNhie(laserviaon BuriedPTH)YesYesYes
      Laser Hole FillingYesYesYes
      TechnicalltemMass ProductAdvanced Technolgy
      2017year2018year2019year
      Drill hole depth ratioThroughHole2017year.40:1.40:1
      Aspet RatioMicro Via.35:11.2:11.2:1
      Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
      Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
      Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
      BGAPitch mm(Mil)0.30.30.3
      Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
      Line Width Control∠2.5MIL±0.50±0.50±0.50
      2.5Mil≤L/W∠4mil±0.50±0.50±0.50
      ≦3mil±0.60±0.60±0.60
      Laminated structureLayer by layer3+N+34+N+45+N+5
      Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
      Multi-layer overlayN+NN+NN+N
      N+X+NN+X+NN+X+N
      sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
      Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
      PTH filling processPTH resin plug hole + plating fill
      Electroplated hole/copper plug hole
      PTH resin plug hole + plating fill
      Electroplated hole/copper plug hole
      PTH resin plug hole + plating fill
      Electroplated hole/copper plug hole

      PCB, FPC main material supplier

      NOsupplierSupply material nameMaterial origin
      1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
      2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
      3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
      4SanTiePI, covering membraneJapan
      5Born goodFR-4,PI,PP,Copper berthshenzhen, China
      6A rainbowPI, covering membrane,Copper berthTaiwan
      7teflonHigh frequency materialsThe United States
      8RogersHigh frequency materialsThe United States
      9Nippon SteelPI, covering membrane,Copper berthTaiwan
      10sanyoPI, covering membrane,Copper berthJapan
      11South AsiaFR-4,PI,PP,Copper berthTaiwan
      12doosanFR-4,PPSouth Korea
      13Tai Yao plateFR-4,PP,Copper berthTaiwan
      14AlightFR-4,PP,Copper berthTaiwan
      15YaoguangFR-4,PP,Copper berthTaiwan
      16YalongFR-4,PPThe United States
      17ISOALFR-4,PPJapan
      18OAKBuried, buried resistance, PPJapan
      19United States 3MFR-4,PPThe United States
      20BergsCopper and aluminum matrixJapan
      21The suninkTaiwan
      22MuratainkJapan
      23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
      24YasenPPI, covering membraneChina jiangsu
      25Yong Sheng TaiinkChina guangdong panyu
      26mitainkJapan
      27Transcriptceramic materialTaiwan
      28HOMEceramic materialJapan
      29Fe-Ni-MnAlloy Invar, Section SteelTaiwan

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