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Multilayer Flexible HDI PCB Prototype Service HDI3 Blind Buried Hole FR 4 TG180

    Buy cheap Multilayer Flexible HDI PCB Prototype Service HDI3 Blind Buried Hole FR 4 TG180 from wholesalers
     
    Buy cheap Multilayer Flexible HDI PCB Prototype Service HDI3 Blind Buried Hole FR 4 TG180 from wholesalers
    • Buy cheap Multilayer Flexible HDI PCB Prototype Service HDI3 Blind Buried Hole FR 4 TG180 from wholesalers
    • Buy cheap Multilayer Flexible HDI PCB Prototype Service HDI3 Blind Buried Hole FR 4 TG180 from wholesalers

    Multilayer Flexible HDI PCB Prototype Service HDI3 Blind Buried Hole FR 4 TG180

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : 24 layer HDI3 order blind buried hole, FR-4+TG180
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 5-200K/pcs per month
    Delivery Time : 29-30pcs per month,
    Certification : Negotiation
    • Product Details
    • Company Profile

    Multilayer Flexible HDI PCB Prototype Service HDI3 Blind Buried Hole FR 4 TG180

    24 layer HDI3 order blind buried hole, FR-4+TG180,HDI Printed Circuit Boards,flexible circuit board,fast pcb prototype


    Product Description

    1. 24 layer HDI3 order blind buried hole, FR-4+TG180,HDI Printed Circuit Boards,flexible circuit board,fast pcb prototype
    2. Product area: military products
    3. Product structure: 24 layers HDI3 order blind buried hole, FR-4+TG180, component purchasing, SMT+PID high frequency mixing, laser hole 0.10mm, copper hole filling, inner and outer copper thickness 70um, hole copper 25um, impedance ± 10%, plate thickness 4.5mm, Immersion Gold 2u"
    4. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB Standard.
      Quantities range from prototype to volume production.
    5. 100% E-Test
    6. Printed circuit board (pcb) and PCBA product areas
      Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
      Winding circuit board (fpc) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

    Our Services

    1. We are a Manufacturer & Supplier Specializing in Double Side PCB, Multi-Layer PCB, F4BK PCB, Ceramic PCB, Rogers PCB, Aluminum PCB. Meanwhile, we provide PCBA ( Assembly) and ODM, OEM service. We are specializes in a full SMT and through hole PCBA assembly, obtaining components, building prototype quantities, and testing.
    2. 1. High quality,good price and service
    3. 2. Delivery time:5-7days.
    4. 3. Certificates:UL,ISO9001,RoHS

    Our capability

    1. Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products

    2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers' requests or samples. Plastic injection processing available.

    3. We have advanced equipment for through-hole and SMT DIP COB cable assembly.

    4. ROHS compliant and lead-free process.

    5. In-circuit, functional tests& burn-in tests, full system test

    6. High output to guarantee prompt delivery.


    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

    PCB capability and services:
    1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

    2. Flexible PCB (up to 10 layers)

    3. Rigid-flex PCB (up to 8 layers)

    4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
    5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
    6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
    7. Quantities range from prototype to volume production.
    8. 100% E-Test


    PCB Assembly services:

    SMT Assembly
    Automatic Pick & Place
    Component Placement as Small as 0201
    Fine Pitch QEP - BGA
    Automatic Optical Inspection


    Through-hole Assembly
    Wave Soldering
    Hand Assembly and Soldering

    Material Sourcing
    IC pre-programming / Burning on-line

    Function testing as requested

    Aging test for LED and Power boards

    Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
    Packing design


    Certificate:
    IPC Standard
    ISO9001
    ISO/TS16949
    UL


    Testing and value added services:
    AOI (Automatic optical inspection)
    ICT(In-circuit test)
    Reliability test
    X-Ray Test
    Analogue and digital function test
    Firmware programming


    PCB, FPC product application field

    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products


    FAQ:

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q: Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

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