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Order Printed FR4 Circuit Board , High Frequency PCB Design Rapid PCB Prototyping

    Buy cheap Order Printed FR4 Circuit Board , High Frequency PCB Design Rapid PCB Prototyping from wholesalers
     
    Buy cheap Order Printed FR4 Circuit Board , High Frequency PCB Design Rapid PCB Prototyping from wholesalers
    • Buy cheap Order Printed FR4 Circuit Board , High Frequency PCB Design Rapid PCB Prototyping from wholesalers
    • Buy cheap Order Printed FR4 Circuit Board , High Frequency PCB Design Rapid PCB Prototyping from wholesalers
    • Buy cheap Order Printed FR4 Circuit Board , High Frequency PCB Design Rapid PCB Prototyping from wholesalers

    Order Printed FR4 Circuit Board , High Frequency PCB Design Rapid PCB Prototyping

    Ask Lasest Price
    Brand Name : China chao sheng
    Model Number : 8 layers of order two HDI
    Payment Terms : T/T, Western Union
    Supply Ability : 5-200K/pcs per month
    Delivery Time : 18-20day
    Price : Negotiation
    Certification : ISO/UL/RoHS/TS
    • Product Details
    • Company Profile

    Order Printed FR4 Circuit Board , High Frequency PCB Design Rapid PCB Prototyping

    ​8 layers of order two HDI, FR-4, TG180,pcb prototype assembly,rapid prototyping pcb,pcb assembly prototype,prototype pcb,,prototype pcb service,prototype pcb,pcb rapid prototyping

    ​Product Description

    1. 8 layers of order two HDI, FR-4, TG180,pcb rapid ,pcb rapid prototyping,pcb prototype board,pcb assembly prototype,prototype pcb
    2. Product area: Automotive control products
    3. Number of layers: 8 layers of order two HDI, FR-4, TG180, plate thickness 1.60mm, laser hole 0.1mm, hole in the plate, resin hole filling + copper hole filling = metal edging
    4. Impedance tolerance: ±10%
    5. Surface treatment: Shen Jin
    6. Test method: computer 100% E-Test
    7. Packing: vacuum packaging + desiccant + humidity card + carton
    8. Mode of transport: air, sea, motor, logistics, express
    9. Printed circuit board (pcb) and PCBA product areas
      Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
      Winding circuit board (fpc) and FPCA product areas
      CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

    PCB, FPC product application field
    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

    Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

    PCB, FPC process production capability

    TypeJiangxi ChaoshengZhejiang Kunyu
    ScopeDouble Side,Multilayers(4-20)Multilayers(4-28),HDI(4-20)Flex,Rigid Flex
    Double SideCEM-3, FR-4,Rogers RO4233,Bergquist Thermal Clad 12mil–126mil (0.3mm-3.2mm)CEM-3, FR-4,Rogers RO4233,Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)
    Multilayers4-20 layers, board thickness 15mil-126mil (0.38mm-3.2mm)4-28 layers, board thickness 8mil-126mil (0.2mm-3.2mm)
    Buried/Blind Via4-18 layers, board thickness 15mil-126mil(0.38mm-3.2mm)4-20 layers, board thickness 10mil-126mil(0.25mm-3.2mm)
    HDI/1+N+1,2+N+2,3+N+3,Anylayer
    Flex & Rigid-Flex PCB/1-8layers Flex PCB ,2-12layers Rigid-flex PCB HDI+Rigid-flex PCB
    LaminateShengyi,EMC,ITEQ,Panasionic,Hitachi....
    Soldermask Type(LPI)Taiyo,Goo’s,Probimer.....Taiyo,Goo’s,Probimer FPC.....
    Peelable SoldermaskPeters
    Carbon inkNipon
    HASL/Lead Free HASLThickness: 0.5-40umThickness: 0.5-40um
    OSPEntek Plus HT, Preflux F2 LX
    ENIG (Ni-Au)Au:0.03um≤max<0.06um Ni:3um≤max≤6um
    Electro-bondable Ni-AuAu:0.2-1.0um Ni:2.54-10um
    Electro-nickel palladium Ni-AuAu: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm
    Electro. Hard GoldAu:5~50uin(0.125~1.27um); Nithickness:100~250uin(2.50~6.25um)
    Thick tin1.0-1.4um
    CapabilityMass ProductionMass Production
    Min Mechanical Drill Hole0.20mm0.20mm
    Min. Laser Drill Hole/4mil (0.100mm)
    Line Width/Spacing3mil/3mil2mil/2mil
    Max. Panel Size18.5" X 24.5"(470mm X 622mm)21.5" X 24.5"(546mm X 622mm)
    Line Width/Spacing Tolerance+/-10% ~ +/-20%Non electro coating:+/-5um,Electro coating:+/-10um
    PTH Hole Tolerance+/-0.003inch(0.075mm)+/-0.002inch(0.050mm)
    NPTH Hole Tolerance+/-0.002inch(0.050mm)+/-0.002inch(0.050mm)
    Hole Location Tolerance+/-0.003inch(0.075mm)+/-0.002inch(0.050mm)
    Hole to Edge Tolerance+/-0.004inch(0.100mm)+/-0.004inch(0.100mm)
    Edge to Edge Tolerance+/-0.004inch(0.100mm)+/-0.004inch(0.100mm)
    Layer to Layer Tolerance+/-0.004inch(0.100mm)+/-0.003inch(0.075mm)
    Impedance Tolerance+/- 10%+/- 10%
    Warpage %Max ≤0.75%Max≤0.5%


    Technology (HDI Product)

    ITEMProductionTighten Control
    Laser Via Drill/Pad0.125/0.30 , 0.125/0.380.125/0.28 , 0.125/0.36 , 0.20/0.40
    Blind Via Drill/Pad0.25/0.500.20/0.45
    Line Width/Spacing0.10/0.100.075/0.075
    Hole FormationCO2 Laser Direct Drill
    Build Up MaterialFR4 LDP(LDD); RCC 50 ~100 micron
    Cu Thickness on Hole WallBlind Hole: 10um(min)Buried Hole: 13um(min)
    Aspect Ratio0.8 : 1


    Technology (Flexible PCB)

    ProjectAbility
    Roll to roll (one side)YES
    Roll to roll (double)NO
    Volume to roll material width mm250
    Minimum production size mm250x250
    Maximum production size mm500x500
    SMT Assembly patch (Yes/No)YES
    Air Gap capability (Yes/No)YES
    Production of hard and soft binding plate(Yes/No)YES
    Max layers(Hard)10
    Tallest layer(Soft plate)6
    Material Science
    PIYES
    PETYES
    Electrolytic copperYES
    Rolled Anneal Copper FoilYES
    PI
    Covering film alignment tolerance mm±0.1
    Minimum covering film mm0.175
    Reinforcement
    PIYES
    FR-4YES
    SUSYES
    EMI SHIELDING
    Silver InkYES
    Silver FilmYES


    FAQ:
    Q: What files do you use in PCB fabrication?
    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
    Q: Is it possible you could offer sample?
    A: Yes, we can custom you sample to test before mass production
    Q: When will I get the quotation after sent Gerber, BOM and test procedure?
    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
    Q: How can I make sure the quality of my PCB?
    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

























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